Evaluation of Partial Discharge Inception Voltage of Bonding-less Gas Insulation Packaging for High Temperature and High Voltage Power Module
Résumé
The purpose of our work is to develop a power module using gas insulation and bonding-less interconnections to avoid the reliability issues known to current packaging technology. This paper deals with the temperature dependence of partial discharge inception voltage (PDIV) of a developed module up to 300°C. In addition, an attempt is achieved to confirm half-wave rectifying operation up to 300°C using SiC Schottky barrier diodes (SiC-SBD). From these results, the PDs were not detected up to 1500 V and 300°C, proving its ability to be used in high temperature applications.
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