Thermal Boundary Conductance across metal/semiconductor junction, measurement and electrical influences - Université de Reims Champagne-Ardenne Access content directly
Conference Papers Year : 2022

Thermal Boundary Conductance across metal/semiconductor junction, measurement and electrical influences

Domains

Physics [physics] Condensed Matter [cond-mat]

Quentin Pompidou  : Connect in order to contact the contributor

https://hal.science/hal-04434306

Submitted on : Friday, February 2, 2024-11:42:26 AM

Last modification on : Friday, April 26, 2024-3:30:33 AM

No file

Dates and versions

hal-04434306 , version 1 (02-02-2024)

Identifiers

  • HAL Id : hal-04434306 , version 1

Cite

Quentin Pompidou, Mélanie Brouillard, J.F. Robillard, Mihai Chirtoc, Nicolas Horny. Thermal Boundary Conductance across metal/semiconductor junction, measurement and electrical influences. 14ème Journées de la Matière Condensée JMC, Société Française de Physique, Aug 2022, Lyon, France. ⟨hal-04434306⟩

Export

BibTeX XML-TEI Dublin Core DC Terms EndNote DataCite

Collections

CNRS UNIV-VALENCIENNES URCA IEMN UNIV-LILLE ANR ITHEMM RENATECH
13 View
0 Download

Share

Gmail Facebook X LinkedIn More